Options
Arora, Deepak
Loading...
Preferred name
Arora, Deepak
Alternative Name
Arora, D.
Main Affiliation
Scopus Author ID
1 results
Now showing 1 - 1 of 1
- PublicationPolymer Dielectrics for Electronic Packaging: Curing Dynamics of an Epoxy Resin Blend(2024-01-01)
;Saraswati, SiddharthA blend of epoxies, with an amine-based hardener, was cured at different rates between 1 and 20 K/min. The effect of heating rate (β) during curing on the glass transition temperature (T_g), peak curing temperature (T_p) and relative degree of cure (αR) are reported. A heating rate of 7 K/min results in the maximum degree of cure and the highest T_g(>300 °C).